MiJing Z20 Pro 18 IN 1 BGA Reballing Stencil Kit For iPhone X-14Pro Max Middle Layer Motherboard Planting Tin Soldering Platform

MiJing Z20 Pro 18 IN 1 BGA Reballing Stencil Kit For iPhone X-14Pro Max Middle Layer Motherboard Planting Tin Soldering Platform

Features:

• Mijing Z20 Pro 18-in-1 Motherboard Middle Layer BGA Reballing Stencil Platform Jig Fixture is a professional BGA Reballing Stencil Fixture for iPhone X/XR/Xs/Xs Max/11/11 Pro/11Pro Max/12/12 Mini/12 Pro/12Pro Max/13/13 Mini/13 Pro/13Pro Max/14/14 Plus/14 Pro/14Pro Max, convenient and faster for reballing BGA without any damage, offer you the best solution for BGA reballing and repairing

How to use:

• Install the main board on the platform

• Cover the BGA reballing stencil on the mainboard

• Evenly spread tin on the cover of the reballing stencil

• Remove the reballing stencil cover

• Take out the motherboard and cooperate with the hot air gun to solidify the tin point

Package includes:

• 1 x 18-in-1 Planting Tin Platform