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MiJing Z20 Pro Middle Layer BGA Reballing Stencil 24 in 1 Fixture for iPhone X-15 Pro Max Middle Layer Solder Platform

₹3,699.00

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MiJing Z20 Pro Middle Layer BGA Reballing Stencil 24 in 1 Fixture for iPhone X-15 Pro Max Middle Layer Solder Platform

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Martview RB-03 Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template

₹7,699.00

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Martview RB-03 Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template

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Relife RL-044 Android Series BGA Reballing Stencil Set for Qualcomm / MTK / EMMC

₹2,999.00

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Relife RL-044 Android Series BGA Reballing Stencil Set for Qualcomm / MTK / EMMC

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AMAOE Mbga-B18 BGA Platform

₹3,099.00

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AMAOE Mbga-B18 BGA Platform

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AMAOE Mbga-B12 BGA Reballing Stencil Platform

₹2,999.00

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AMAOE Mbga-B12 BGA Reballing Stencil Platform

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AMAOE LAYER X TO 14

₹3,399.00

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AMAOE LAYER X TO 14

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AMAOE X-14 LCD BGA Platform

₹2,199.00

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AMAOE X-14 LCD BGA Platform

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Amaoe PD-A Glue Removal & Tin Planting

₹2,099.00

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Amaoe PD-A Glue Removal & Tin Planting

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Amaoe IP14 BGA315 Hard Disk Reballing Stencil Platform Set for iPhone 14 / 14 Plus / 14 Pro / 14Pro Max

₹2,899.00

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Amaoe IP14 BGA315 Hard Disk Reballing Stencil Platform Set for iPhone 14 / 14 Plus / 14 Pro / 14Pro Max

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AMAOE MFix-14 BGA Platform

₹4,149.00

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AMAOE MFix-14 BGA Platform

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AMAOE IP14 18in1 PCB BGA Platform IPX-14

₹4,499.00

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AMAOE IP14 18in1 PCB BGA Platform IPX-14

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AMAOE Mbga-B18 BGA Platform

₹3,499.00

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AMAOE Mbga-B18 BGA Platform

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AMAOE Mbga-B16 BGA Platform

₹2,999.00

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AMAOE Mbga-B16 BGA Platform

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Amaoe Mbga-B14 BGA Reballing Stencil tin planting table For Samsung Exynos CPU removal glue positioning plate CPU steel mesh

₹3,399.00

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Amaoe Mbga-B14 BGA Reballing Stencil tin planting table For Samsung Exynos CPU removal glue positioning plate CPU steel mesh

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AMAOE Mbga-B12 BGA Reballing Stencil Platform

₹3,849.00

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AMAOE Mbga-B12 BGA Reballing Stencil Platform

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Amaoe Mbga-B8 BGA Reballing Platform for Android CPU SM7250 7350 6150 MSM8952 8909 MT6761 6762 6765 Glue Removing

₹3,349.00

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Amaoe Mbga-B8 BGA Reballing Platform for Android CPU SM7250 7350 6150 MSM8952 8909 MT6761 6762 6765 Glue Removing

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Amaoe Mbga-B7 BGA Reballing Platform

₹3,599.00

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Amaoe Mbga-B7 BGA Reballing Platform

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Amaoe Mbga-B6 BGA Reballing Platform

₹3,499.00

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Amaoe Mbga-B6 BGA Reballing Platform

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IP14 18in1 PCB BGA Platform IPX-14

₹5,499.00

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IP14 18in1 PCB BGA Platform IPX-14

Product Name – AMAOE /IPX-14/18 in 1 middle layer tin planting platform for iPhone X11/12/13/14 series middle layer stencil Item NO. – 2163919 BGA reballing kit – Stencil, Tin planting platform Weight – 1.26 kg = 2.7778 I6 = 44.4452 oz Category – Phone repair tools > BGA reballing kit Tag – tin planting platform, reballing stencil, iPhone stencil, AMAOE, middle layer stencil, 18 in 1 Brand – AMAOE Creation Time – 2022-11-02