Magic Pad Multi-functional Positioning Presssure-reducing Protective Pad for BGA CPU IC Reballing
₹649.00
Magic Pad Multi-functional Positioning Presssure-reducing Protective Pad for BGA CPU IC Reballing
Description
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Features:
- Powerful, can be used for motherboard chip grinding/polishing/drilling/rust removal
- Equipped with 11 grinding heads, suitable for various chip IC grinding, cutting motherboards, brackets, removing screws, and other applications
- Pure copper chuck, high concentricity, cross jaw design, more stable and firm clamping, can be used for 2.35mm shank diameter grinding head
- Wireless restraint, light body, carry it with you, use it wherever you go
- Seiko manufactures the motor so that the motor can output strong power smoothly, and the three-speed variable speed can be freely controlled
- Large-capacity rechargeable lithium battery 3.6V/900mah (configured with 1 charging cable)
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