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Hydra Dongle
₹5,699.00
IP14 18in1 PCB BGA Platform IPX-14
₹5,499.00
IP14 18in1 PCB BGA Platform IPX-14
Product Name – AMAOE /IPX-14/18 in 1 middle layer tin planting platform for iPhone X11/12/13/14 series middle layer stencil Item NO. – 2163919 BGA reballing kit – Stencil, Tin planting platform Weight – 1.26 kg = 2.7778 I6 = 44.4452 oz Category – Phone repair tools > BGA reballing kit Tag – tin planting platform, reballing stencil, iPhone stencil, AMAOE, middle layer stencil, 18 in 1 Brand – AMAOE Creation Time – 2022-11-02INFINITY DONGLE (CM2)
₹5,399.00
GVM T115 Soldering Station
₹5,299.00